The global High End PCB market size is projected to grow from US$ 72890 million in 2024 to US$ 114590 million in 2030; it is expected to grow at a CAGR of 7.8% from 2024 to 2030.

ReportPrime, Inc. (LPI) ' newest research report, the “High End PCB Industry Forecast” looks at past sales and reviews total world High End PCB sales in 2023, providing a comprehensive analysis by region and market sector of projected High End PCB sales for 2024 through 2030. With High End PCB sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world High End PCB industry.

This Insight Report provides a comprehensive analysis of the global High End PCB landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on High End PCB portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global High End PCB market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for High End PCB and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global High End PCB.

Segmentation by Type:

• Multi-layer PCB
• HDI PCBs
• IC Substrates
• Flexible Printed Circuit (FPC)

Segmentation by Application:

• Smart Phones
• PC
• Consumer Electronics
• Communications
• Automotive Electronics
• Industrial & Medical
• Military and Aerospace
• Others

This report also splits the market by region:

• Americas
• United States
• Canada
• Mexico
• Brazil
• APAC
• China
• Japan
• Korea
• Southeast Asia
• India
• Australia
• Europe
• Germany
• France
• UK
• Italy
• Russia
• Middle East & Africa
• Egypt
• South Africa
• Israel
• Turkey
• GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.

Company's Coverage:

• Unimicron
• DSBJ (Dongshan Precision)
• Zhen Ding Technology
• Kinwong
• Shennan Circuit
• Tripod Technology
• Suntak Technology
• Shenzhen Fastprint Circuit Tech
• Gul Technologies Group
• Nippon Mektron
• Compeq Manufacturing
• TTM Technologies, Inc
• Ibiden
• HannStar Board Corporation
• AT&S
• Nan Ya PCB
• Kingboard Holdings
• SEMCO
• Shinko Electric Industries
• YOUNGPOONG
• WUS Printed Circuit
• Meiko Electronics
• LG Innotek
• Kinsus Interconnect Technology
• Kyocera
• Toppan
• Daeduck Electronics
• Zhuhai Access Semiconductor
• Simmtech
• Flexium Interconnect.Inc

Key Questions Addressed in this Report

1. What is the 10-year outlook for the global High End PCB market?
2. What factors are driving High End PCB market growth, globally and by region?
3. Which technologies are poised for the fastest growth by market and region?
4. How do High End PCB market opportunities vary by end market size?
5. How does High End PCB break out by Type, by Application?