Global Semiconductor Backgrinding Tape Market Growth 2024-2030

Report ID: 2885550 | Published Date: Mar 2025 | No. of Page: 125 | Base Year: 2024 | Rating: 4.5 | Webstory: Check our Web story

Semiconductor backgrinding tapes are essential in the wafer thinning process, known as backgrinding, where wafers are thinned down to the required thickness for further processing. These tapes provide protection and support to the wafer during grinding, ensuring that the delicate wafer surface remains intact.

The global Semiconductor Backgrinding Tape market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow at a CAGR of % from 2024 to 2030.

ReportPrime's newest research report, the “Semiconductor Backgrinding Tape Industry Forecast” looks at past sales and reviews total world Semiconductor Backgrinding Tape sales in 2023, providing a comprehensive analysis by region and market sector of projected Semiconductor Backgrinding Tape sales for 2024 through 2030. With Semiconductor Backgrinding Tape sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Backgrinding Tape industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Backgrinding Tape landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Backgrinding Tape portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Backgrinding Tape market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Backgrinding Tape and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Backgrinding Tape.

United States market for Semiconductor Backgrinding Tape is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

China market for Semiconductor Backgrinding Tape is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Europe market for Semiconductor Backgrinding Tape is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Global key Semiconductor Backgrinding Tape players cover:

  • Furukawa
  • Mitsui Chemicals ICT Materia, Inc.
  • Nitto Denko Corporation
  • Maxell, Ltd.
  • Lintec

In terms of revenue, the global two largest companies occupied for a share nearly % in 2023.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Backgrinding Tape market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

  • UV Curable Backgrinding Tape
  • Non-UV Curable Backgrinding Tape

Segmentation by Application:

  • Integrated Circuit
  • MEMS
  • Advanced Packaging
  • Others

This report also splits the market by region:

  • Americas
    • United States
    • Canada
    • Mexico
    • Brazil
  • APAC
    • China
    • Japan
    • Korea
    • Southeast Asia
    • India
    • Australia
  • Europe
    • Germany
    • France
    • UK
    • Italy
    • Russia
  • Middle East & Africa
    • Egypt
    • South Africa
    • Israel
    • Turkey
    • GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration:

  • Furukawa
  • Mitsui Chemicals ICT Materia, Inc.
  • Nitto Denko Corporation
  • Maxell, Ltd.
  • Lintec
  • KGK Chemical Corporation
  • SEKISUI CHEMICAL CO., LTD.
  • 3M
  • Resonac
  • Daeyhun ST co., Ltd
  • Solar plus
  • NADCO
  • Solar Plus Company

Key Questions Addressed in this Report:

  1. What is the 10-year outlook for the global Semiconductor Backgrinding Tape market?
  2. What factors are driving Semiconductor Backgrinding Tape market growth, globally and by region?
  3. Which technologies are poised for the fastest growth by market and region?
  4. How do Semiconductor Backgrinding Tape market opportunities vary by end market size?
  5. How does Semiconductor Backgrinding Tape break out by Type, by Application?
Frequently Asked Questions
Semiconductor Backgrinding Tape report offers great insights of the market and consumer data and their interpretation through various figures and graphs. Report has embedded global market and regional market deep analysis through various research methodologies. The report also offers great competitor analysis of the industries and highlights the key aspect of their business like success stories, market development and growth rate.
Semiconductor Backgrinding Tape report is categorised based on following features:
  1. Global Market Players
  2. Geopolitical regions
  3. Consumer Insights
  4. Technological advancement
  5. Historic and Future Analysis of the Market
Semiconductor Backgrinding Tape report is designed on the six basic aspects of analysing the market, which covers the SWOT and SWAR analysis like strength, weakness, opportunity, threat, aspirations and results. This methodology helps investors to reach on to the desired and correct decision to put their capital into the market.

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